Er-Ping Li : rechercher sur Z-Library

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1

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li, Xing-Chang Wei, Cangellaris, A.C., En-Xiao Liu, Yao-Jiang Zhang, D'Amore, M., Joungho Kim, Sudo, T.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2010

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2010

2

A Unique Extraction of Metamaterial Parameters Based on Kramers–Kronig Relationship

Szabó, Z., Gi-Ho Park, Hedge, R., Er-Ping Li

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2010

Langue:

english

Fichier:

PDF, 1.31 MB

english, 2010

3

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - An integrated UHF/UWB tag antenna with radome for indoor positioning system

Li, Da, Shen, Zhong-Xiang, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 1014 KB

english, 2018

4

Hybrid Microstrip T-Stub/Defected Ground Structure Cell for Electromagnetic Interference Bandpass Filter Design

Xun Luo, Jian-Guo Ma, Er-Ping Li, Kaixue Ma

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2011

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2011

5

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Modeling and measurement of a common-mode filter based on the 3-D transmission line structure

Li, Yong-Sheng, Swaminathan, Madhavan, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 155 KB

english, 2018

6

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Analysis and experimental validation of power distribution network with multi-slots parallel-plane structure

Li, Yan, Cao, Wen-Yuan, Zuo, Pan-Pan, Gao, Zhi-Yi, Zheng, Hong-Xing, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 1.25 MB

english, 2018

7

[IEEE 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Hangzhou, China (2019.10.21-2019.10.23)] 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - A Novel Frequency Selective Surface Applied for EMI Suppression in Integrated Circuit Package

Zuo, Panpan, Jin, Hang, Li, Tianwu, Li, Er-Ping

Année:

2019

Fichier:

PDF, 228 KB

2019

8

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

Yao-Jiang Zhang, Zaw Zaw Oo, Xing-Chang Wei, En-Xiao Liu, Jun Fan, Er-Ping Li

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2010

Langue:

english

Fichier:

PDF, 989 KB

english, 2010

9

A coupled efficient and systematic full-wave time-domain macromodeling and circuit Simulation method for signal integrity analysis of high-speed interconnects

Er-Ping Li, En-Xiao Liu, Le-Wei Li, Mook-Seng Leong

Journal:

IEEE Transactions on Advanced Packaging

Année:

2004

Langue:

english

Fichier:

PDF, 409 KB

english, 2004

10

Enhancing the Reception of Propagating Surface Plasmons Using a Nanoantenna

Mingxia Gu, Ping Bai, Er-Ping Li

Journal:

IEEE Photonics Technology Letters

Année:

2010

Langue:

english

Fichier:

PDF, 203 KB

english, 2010

11

Design of Subwavelength CMOS Compatible Plasmonic Photodetector for Nano-Electronic-Photonic Integrated Circuits

Mingxia Gu, Ping Bai, Hong Son Chu, Er-Ping Li

Journal:

IEEE Photonics Technology Letters

Année:

2012

Langue:

english

Fichier:

PDF, 562 KB

english, 2012

12

[IEEE 2012 International Symposium on Electromagnetic Compatibility - EMC EUROPE - Rome, Italy (2012.09.17-2012.09.21)] International Symposium on Electromagnetic Compatibility - EMC EUROPE - Distributed decoupling analysis on PG planes for PDN design

Luo, Guang-Xiao, Cui, Xiang, Wei, Xing-Chang, Li, Er-Ping

Année:

2012

Langue:

english

Fichier:

PDF, 817 KB

english, 2012

13

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Systematic Microwave Network Analysis for 3D Integrated Systems

Année:

2012

Langue:

english

Fichier:

PDF, 1.23 MB

english, 2012

14

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Efficient signal and power integrity analysis by using modal decomposition and integral equations

Xing-Chang Wei,, Er-Ping Li,, En-Xiao Liu,

Année:

2010

Langue:

english

Fichier:

PDF, 490 KB

english, 2010

15

[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - The Effects of Signal Trace's Termination on Ground Bounce and Common-Mode Radiation

Chua, Eng-Kee, Li, Er-Ping, See, Kye-Yak, Chang, Weng-Yew

Année:

2007

Langue:

english

Fichier:

PDF, 223 KB

english, 2007

16

Modal Analysis of Microstrip Lines Using Singular Value Decomposition Analysis of FDTD Simulations

Ahmed, Shahid, Li, Er-Ping

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2008

Langue:

english

Fichier:

PDF, 360 KB

english, 2008

17

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Analysis on the effectiveness of printed circuit board edge termination using discrete components instead of implementing the 20-H rule

Montrose, M.I., Liu Enxiao,, Er-Ping Li,

Année:

2004

Langue:

english

Fichier:

PDF, 404 KB

english, 2004

18

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Analysis on the effectiveness of high speed printed circuit board edge radiated emissions based on stimulus source location

Montrose, M.I., Jin Hong-Fang,, Er-Ping Li,

Année:

2004

Langue:

english

Fichier:

PDF, 393 KB

english, 2004

19

Integral Equation Technique for the Simulation of Signal Integrity and Power Integrity

Wei, Xing-Chang, Yang, De-Cao, Li, Er-Ping

Journal:

Année:

2011

Langue:

english

Fichier:

PDF, 2.28 MB

english, 2011

20

Electromagnetic Characteristics of Multiport TSVs Using L-2L De-Embedding Method and Shielding TSVs

Li, Yong-Sheng, Li, Yan, Min, Qiu, Wu, Ke, Liu, En-Xiao, Hao, Ran, Chen, Hong-Sheng, Zhuo, Cheng, Yin, Wen-Yan, Wang, Zhe-Yao, Yu, Hui-Chun, Li, Er-Ping

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2017

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2017

21

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - A novel heatsink with mushroom-type EBG structure for EMI radiation suppression

Jin, Hang, Zhang, Le, Yang, Xiao-Li, Cheng, Ping, Li, Er-Ping, Zhang, Yao-Jiang

Année:

2018

Langue:

english

Fichier:

PDF, 408 KB

english, 2018

22

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - EMI prediction of packages by deep neural network

Jin, Hang, Ma, Hanzhi, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 146 KB

english, 2018

23

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Electrical-thermal co-simulation for through silicon via and active tier in 3-D IC

Min, Qiu, Zhou, Shi-Yun, Zhuo, Cheng, Jin, Jian-Ming, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 144 KB

english, 2018

24

Hybridization of the Scattering Matrix Method and Modal Decomposition for Analysis of Signal Traces in a Power Distribution Network

Oo, Zaw Zaw, Li, Er-Ping, Wei, Xing-Chang, Liu, En-Xiao, Zhang, Yao-Jiang, Li, Le-Wei Joshua

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2009

Langue:

english

Fichier:

PDF, 535 KB

english, 2009

25

Compact and efficient coupler to interface hybrid dielectric-loaded plasmonic waveguide with silicon photonic slab waveguide

Rakesh G. Mote, Hong-Son Chu, Ping Bai, Er-Ping Li

Journal:

Optics Communications

Année:

2012

Langue:

english

Fichier:

PDF, 737 KB

english, 2012

26

Confocal Microwave Imaging for Breast Cancer Detection: Delay-Multiply-and-Sum Image Reconstruction Algorithm

Hooi Been Lim, Nguyen Thi Tuyet Nhung, Er-Ping Li, Nguyen Duc Thang

Journal:

IEEE Transactions on Biomedical Engineering

Année:

2008

Langue:

english

Fichier:

PDF, 553 KB

english, 2008

27

A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow Slots

Guo-Ping Zou, Er-Ping Li, Xing-Chang Wei, Guang-Xiao Luo, Xiang Cui

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2010

Langue:

english

Fichier:

PDF, 429 KB

english, 2010

28

Modeling of the Simultaneous Switching Noise in High Speed Electronic Circuit with the Integral Equation Method and Vector Fitting Method

Guo-Ping Zou, Xing-Chang Wei, Er-Ping Li, Xiang Cui, Wei-Dong Zhang

Journal:

IEEE Transactions on Magnetics

Année:

2011

Langue:

english

Fichier:

PDF, 537 KB

english, 2011

29

[IEEE 2012 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Singapore, Singapore (2012.05.21-2012.05.24)] 2012 Asia-Pacific Symposium on Electromagnetic Compatibility - Time domain modeling: From nano-electronics to nano-photonics

Ahmed, Iftikhar, Li, Er-Ping

Année:

2012

Langue:

english

Fichier:

PDF, 222 KB

english, 2012

30

[IEEE 17th International Zurich Symposium on Electromagnetic Compatibility - Singapore (2006.02.27-2006.03.3)] 2006 17th International Zurich Symposium on Electromagnetic Compatibility - Extraction of circuit parameters for transmission lines by compact 2D FDFD method

En-Xiao Liu,, Er-Ping Li,, Le-Wei Li,

Année:

2006

Langue:

english

Fichier:

PDF, 457 KB

english, 2006

31

[IEEE 2012 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Singapore, Singapore (2012.05.21-2012.05.24)] 2012 Asia-Pacific Symposium on Electromagnetic Compatibility - Systematic analysis for static and dynamic drops in power supply grids of 3-D integrated circuits

Oo, Zaw Zaw, Liu, En-Xiao, Cubillo, Joseph Romen, Li, Er-Ping

Année:

2012

Langue:

english

Fichier:

PDF, 1.05 MB

english, 2012

32

Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

Zaw Zaw Oo, En-Xiao Liu, Xing Chang Wei, Yaojiang Zhang, Er-Ping Li

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 974 KB

english, 2011

33

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Introduction

Année:

2012

Langue:

english

Fichier:

PDF, 277 KB

english, 2012

34

[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Far-field prediction from amplitude-only near-field measurements using equivalent electric currents

Zhao, Wei-Jiang, Park, Hark Byeong, Tan, Mark, Park, Hyun Ho, Liu, En-Xiao, Song, Eakhwan, Li, Er-Ping

Année:

2012

Langue:

english

Fichier:

PDF, 610 KB

english, 2012

35

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Supplemental Images

Année:

2012

Langue:

english

Fichier:

PDF, 388 KB

english, 2012

36

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Front Matter

Année:

2012

Langue:

english

Fichier:

PDF, 131 KB

english, 2012

37

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Index

Année:

2012

Langue:

english

Fichier:

PDF, 40 KB

english, 2012

38

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Hybrid Integral Equation Modeling Methods for 3D Integration

Année:

2012

Langue:

english

Fichier:

PDF, 606 KB

english, 2012

39

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Macromodeling of Complex Interconnects in 3D Integration

Année:

2012

Langue:

english

Fichier:

PDF, 715 KB

english, 2012

40

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Modeling of Through-Silicon Vias (TSV) in 3D Integration

Année:

2012

Langue:

english

Fichier:

PDF, 326 KB

english, 2012

41

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || 2.5D Simulation Method for 3D Integrated Systems

Année:

2012

Langue:

english

Fichier:

PDF, 982 KB

english, 2012

42

[IEEE International Symposium on Electromagnetic Compatibility - Boston, MA, USA (18-22 Aug. 2003)] 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) - Investigations on delay interconnect lines for high-speed designs with the numerical technique

Weiliang Yuan,, Er-Ping Li,

Année:

2003

Langue:

english

Fichier:

PDF, 324 KB

english, 2003

43

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Analysis of signal propagation in high-speed differential signal lines with full-wave time-domain technique

Weiliang Yuan,, Er-Ping Li,

Année:

2002

Langue:

english

Fichier:

PDF, 396 KB

english, 2002

44

[IEEE 2007 18th International Zurich Symposium on Electromagnetic Compatibility - Munich, Germany (2007.09.24-2007.09.28)] 2007 18th International Zurich Symposium on Electromagnetic Compatibility - A SPICE-compatible full-wave equivalent circuit model for printed circuit structure analysis

Eng-Kee Chua,, Er-Ping Li,, Kye-Yak See,, Wenyan Yin,

Année:

2007

Langue:

english

Fichier:

PDF, 230 KB

english, 2007

45

[IEEE Exhibition - Singapore (2008.05.19-2008.05.23)] 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility - The stability analysis of the three-dimensional LOD-FDTD method

Ahmed, Iftikhar, Eng-Kee Chua,, Er-Ping Li,

Année:

2008

Langue:

english

Fichier:

PDF, 122 KB

english, 2008

46

[IEEE 2010 International Symposium on Signals, Systems and Electronics (ISSSE 2010) - Nanjing (2010.09.17-2010.09.20)] 2010 International Symposium on Signals, Systems and Electronics - Signal integrity analysis of through-silicon via based 3D integrated circuit

Er-Ping Li,, En-Xiao Liu,

Année:

2010

Langue:

english

Fichier:

PDF, 225 KB

english, 2010

47

[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - A differential evolution based equivalent source approach for predicting electromagnetic emissions using near-field scanning

Zhao, Wei-Jiang, Wang, Binfang, Liu, En-Xiao, Park, Hark Byeong, Park, Hyun Ho, Song, Eakhwan, Li, Er-Ping

Année:

2013

Langue:

english

Fichier:

PDF, 1.15 MB

english, 2013

48

[IEEE 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Beijing, China (2010.04.12-2010.04.16)] 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Behavioral modeling for electromagnetic immunity analysis for electronic systems

Gao, Xian-Ke, Chua, Eng-Kee, Li, Er-Ping

Année:

2010

Langue:

english

Fichier:

PDF, 1.28 MB

english, 2010

49

Fast Contour Integral Equation Method for Wideband Power Integrity Analysis

Zhao, Huapeng, Liu, En-Xiao, Hu, Jun, Li, Er-Ping

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2014

Langue:

english

Fichier:

PDF, 1.55 MB

english, 2014

50

A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages With Large Number of Vias

Oo, Zaw Zaw, Liu, En-Xiao, Li, Er-Ping, Wei, Xingchang, Zhang, Yaojiang, Tan, Mark, Li, Le-Wei Joshua, Vahldieck, RÜdiger

Journal:

IEEE Transactions on Advanced Packaging

Année:

2008

Langue:

english

Fichier:

PDF, 1.05 MB

english, 2008